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1

Lower-Bound Limit Analysis of Seismic Passive Earth Pressure on Rigid Walls

Tang, Chong, Phoon, Kok-Kwang, Toh, Kim-Chuan

Journal:

International Journal of Geomechanics

Year:

2014

Language:

english

File:

PDF, 2.02 MB

english, 2014

2

Performance of Zero-Level Fill-In Preconditioning Techniques for Iterative Solutions with Geotechnical Applications

Chen, Xi, Phoon, Kok-Kwang, Toh, Kim-Chuan

Journal:

International Journal of Geomechanics

Year:

2012

Language:

english

File:

PDF, 1.15 MB

english, 2012

3

Inexact Block Diagonal Preconditioners to Mitigate the Effects of Relative Differences in Material Stiffnesses

Chaudhary, Krishna Bahadur, Phoon, Kok-Kwang, Toh, Kim-Chuan

Journal:

International Journal of Geomechanics

Year:

2013

Language:

english

File:

PDF, 1.99 MB

english, 2013

4

Block preconditioners for symmetric indefinite linear systems

Kim-Chuan Toh, Kok-Kwang Phoon, Swee-Huat Chan

Journal:

International Journal for Numerical Methods in Engineering

Year:

2004

Language:

english

File:

PDF, 218 KB

english, 2004

5

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Optimization of a Thermoelectric Cooler-Heat Sink Combination for Active Processor Cooling

Hasan, Mohd. Hafiz, Toh, Kok Chuan

Year:

2007

Language:

english

File:

PDF, 417 KB

english, 2007

6

Fast iterative solution of large undrained soil-structure interaction problems

Kok-Kwang Phoon, Swee-Huat Chan, Kim-Chuan Toh, Fook-Hou Lee

Journal:

International Journal for Numerical and Analytical Methods in Geomechanics

Year:

2003

Language:

english

File:

PDF, 317 KB

english, 2003

7

Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Tang, Gong Yue, Tan, Siow Pin, Khan, Navas, Pinjala, D., Lau, John H., Yu, Ai Bin, Vaidyanathan, Kripesh, Toh, Kok Chuan

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.78 MB

english, 2010

8

Fabrication of Silicon Carriers With TSV Electrical Interconnections and Embedded Thermal Solutions for High Power 3-D Packages

Aibin Yu,, Khan, N., Archit, G., Pinjala, D., Kok Chuan Toh,, Kripesh, V., Seung Wook Yoon,, Lau, J.H.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2009

Language:

english

File:

PDF, 3.06 MB

english, 2009

9

Thermal resistance of two solids in contact through a cylindrical joint

Kek-Kiong Tio, Toh Kok Chuan

Journal:

International Journal of Heat and Mass Transfer

Year:

1998

Language:

english

File:

PDF, 994 KB

english, 1998

10

Development of Single Phase Liquid Cooling Solution for 3-D Silicon Modules

Tan, S. P., Toh, Kok Chuan, Khan, Navas, Pinjala, D., Kripesh, V.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2011

Language:

english

File:

PDF, 1.51 MB

english, 2011

11

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

Khan, Navas, Yu, Li Hong, Pin, Tan Siow, Ho, Soon Wee, Kripesh, Vaidyanathan, Pinjala, Damaruganath, Lau, John H., Chuan, Toh Kok

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 987 KB

english, 2013

12

Comparison between iterative solution of symmetric and non-symmetric forms of Biot's FEM equations using the generalized Jacobi preconditioner

Kim-Chuan Toh, Kok-Kwang Phoon

Journal:

International Journal for Numerical and Analytical Methods in Geomechanics

Year:

2008

Language:

english

File:

PDF, 208 KB

english, 2008

13

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Spray cooling enhancement studies using dielectric liquid

Kandasamy, Ranjith, Liu, Pengfei, Feng, Huicheng, Wong, Teck Neng, Toh, Kok Chuan

Year:

2018

Language:

english

File:

PDF, 252 KB

english, 2018

14

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - 3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

Khan, Navas, Hong Yu,, Pin, Tan Siow, Ho, Soon Wee, Su, Nandar, Hnin, Wai Yin, Kripesh, Vaidyanathan, Lau, John H., Chuan, Toh Kok

Year:

2009

Language:

english

File:

PDF, 960 KB

english, 2009

15

[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - An adaptable compact thermal model for BGA packages

Ming Xie,, Kok Chuan Toh,, Pinjala, D.

Year:

2002

Language:

english

File:

PDF, 884 KB

english, 2002

16

Convective filmwise condensation on the outer surface of a vertical tube: A theoretical analysis

Liu, Pengfei, Ho, Jin Yao, Wong, Teck Neng, Toh, Kok Chuan

Journal:

International Journal of Heat and Mass Transfer

Year:

2020

File:

PDF, 1.96 MB

2020

17

Axisymmetric Lower-Bound Limit Analysis Using Finite Elements and Second-Order Cone Programming

Tang, Chong, Toh, Kim-Chuan, Phoon, Kok-Kwang

Journal:

Journal of Engineering Mechanics

Year:

2014

Language:

english

File:

PDF, 3.75 MB

english, 2014

18

Shock and vibration protection of submerged jet impingement cooling systems: Theory and experiment

Haji Hosseinloo, Ashkan, Tan, Siow Pin, Yap, Fook Fah, Toh, Kok Chuan

Journal:

Applied Thermal Engineering

Year:

2014

Language:

english

File:

PDF, 1.72 MB

english, 2014

19

[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - Fabrication of silicon carriers with TSV electrical interconnections and embedded thermal solutions for high power 3-D package

Aibin Yu,, Navas Khan,, Giridhar Archit,, Damaruganath Pinjala,, Kok Chuan Toh,, Vaidyanathan Kripesh,, Seung Wook Yoon,, Lau, John H.

Year:

2008

Language:

english

File:

PDF, 1.05 MB

english, 2008

20

MEMS-Micropumps: A Review

Nguyen, Nam-Trung, Huang, Xiaoyang, Chuan, Toh Kok

Journal:

Journal of Fluids Engineering

Year:

2002

Language:

english

File:

PDF, 299 KB

english, 2002

21

Effect of footing width on N γ and failure envelope of eccentrically and obliquely loaded strip footings on sand

Tang, Chong, Phoon, Kok-Kwang, Toh, Kim-Chuan

Journal:

Canadian Geotechnical Journal

Year:

2015

Language:

english

File:

PDF, 3.12 MB

english, 2015

22

[IEEE 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005. - Raleigh, NC, USA (2005.11.6-2005.11.6)] 31st Annual Conference of IEEE Industrial Electronics Society, 2005. IECON 2005. - Electrode verification and management system for automation of EDM process in mould industry

Hao Zeng,, Beng Siong Lim,, Geok Hong Phua,, Zhongqiang Ding,, Leck Leng Aw,, Toh Khoong Tan,, Xiang Li,, Kiah Mok Goh,, Pin Tat Hee,, Yan Chuan Goh,, Kok Kee Yuen,

Year:

2005

Language:

english

File:

PDF, 662 KB

english, 2005

23

[IEEE 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Experimental study of bubble dynamics in highly wetting dielectric liquid pool boiling through high-speed video

Tong, Wei, Wu, Chenlong, Toh, Kok Chuan, Duan, Fei

Year:

2016

Language:

english

File:

PDF, 643 KB

english, 2016

24

Influence of air on heat transfer of a closed-loop spray cooling system

Liu, Pengfei, Kandasamy, Ranjith, Feng, Huicheng, Wong, Teck Neng, Toh, Kok Chuan

Journal:

Experimental Thermal and Fluid Science

Year:

2019

File:

PDF, 5.54 MB

2019

25

Thermal Analysis for Underground Data Centres in the Tropics

Jiao, Yanmei, Li, Yuanlong, Wen, Yonggang, Wah Wong, Yew, Chuan Toh, Kok, Cheng Chua, Chee, Ang, Wilson

Journal:

Energy Procedia

Year:

2017

File:

PDF, 1.17 MB

2017

26

Toward green data centers as an interruptible load for grid stabilization in Singapore

Xia, Wenfeng, Wen, Yonggang, Toh, Kok-Chuan, Wong, Yew-Wah

Journal:

IEEE Communications Magazine

Year:

2015

Language:

english

File:

PDF, 536 KB

english, 2015

27

Thermal analysis of micro heat pipes using a porous-medium model

Kek-Kiong Tio, Chang Yu Liu, Kok Chuan Toh

Journal:

Heat and Mass Transfer

Year:

2000

Language:

english

File:

PDF, 156 KB

english, 2000

28

[IEEE 2008 10th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2008.12.9-2008.12.12)] 2008 10th Electronics Packaging Technology Conference - Fluidic Interconnects in Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules

Yue, Tang Gong, Pin, Tan Siow, Khan, Navas, Pinjala, D., Lau, John H., Bin, Yu Ai, Vaidyanathan, Kripesh, Chuan, Toh Kok

Year:

2008

Language:

english

File:

PDF, 6.32 MB

english, 2008

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